External Visual Inspection
Checking PIN condition, sanding marks and manufacturer’s LOGO.
X-ray Analysis
Checking the lead frame of chips, wafer size and gold wire binding diagram.
Heated Solvent Test
Aggressive and effective method of uncovering counterfeit devices
Decapsulation and Die Analysis
The brittle nature of silicon turns the die into the weakest part of the integrated circuit complex object.
Scanning Electron Microscopy
Use an electron beam to image samples with a resolution down to the nanometer scale
Pin Verification Test
verifying performance, speed, durability and reliability of components.